iNEMI webinar

Impact of Green Mold Compounds on First- and Second-Level Interconnect Reliability


Imec, a research institute based in Belgium (and an iNEMI member), is scheduling a special webinar for our membership to talk about reliability issues related to green mold compounds.
New electronic materials are being introduced by component, PCB manufacturers and assembly plants to cope with the IC-technology evolution, environmental legislation (RoHS) and the “going green” trend. One of these trends has been the replacement of the mold compound of plastic packaged IC components by so-called “green mold compounds” (GMC) which are low-halogen, typically highly silica filled and, therefore, have a low Coefficient of Thermal Expansion (CTE). The low CTE is the root cause of the second level solder joint risk.
The change-over has gradually taken place in the last five years and has reached a very high penetration level without being noticed by most component users. Although these new mold compounds have many environmental and technical benefits, they also may endanger the reliability of electronics significantly. Product lifetime may be divided by a factor of four when GMC-based components are introduced. This webinar will explain the risks that GMC-based IC packages pose to electronics as well as the parameters of influence.

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Wednesday, January 30, 2013

The webinar will start at 8:30 am, Mountain Time (Arizona, GMT-07:00) = 16:30 GMT+1