New solder joint compositions: a literature review on reliability


In the first years after the introduction of the RoHS directive in 2006, SnAgCu (SAC) with Ag percentage between 3 and 4.5% was the main solder composition used by the industry to replace SnPb solder. However, in the recent years, many new lead-free compositions were and are being introduced by the industry. This can be triggered by cost reasons (e.g. lower Ag content), a lower process temperature or to improve the reliability.
In this webinar, we will give an overview on the thermal cycling and mechanical shock reliability of these new compositions, based on studies published in literature.

Presented by: Bart Vandevelde & Riet Labie (imec)

Thursday, March 1, 2018 - 10:00
Participation fee: 

Free of charge, but registration is required.

This webinar is a dissemination activity of the INPROVOL project funded by Vlaio.