Quality and reliability impact of electronic component selection, the EDM-D-002 Guideline explained


Public, Members and Partners


The selection of components that make up the Bill-of-Material, especially the package type selection, determines the manufacturability and the reliability of the Printed Board Assembly.

This workshop presents the EDM-D-002: Electronic Component Specification guideline. It addresses the specification of assembly aspects of components like Moisture and Process Sensitivity levels, solder process compatibility and quality (yield) as well as reliability aspects.

Our host ON Semiconductor will present the electronic component requirements set by the automotive industry and potential assembly and reliability risks.

The assessment of package and interconnection failures using physico-chemical analysis and thermo-mechanical simulation will be discussed by cEDM based on practical cases.

 Workshop 18


Members and partners can download the presentations of workshop 18 here.

  •  Intro
  •  Presentation1: Manufacturability and reliability impact of package selection: The EDM-D-002 Guideline
  •  Presentation2: Component package selection in automotive electronics
  •  Presentation3: Package and interconnection failure assessment
Friday, March 14, 2014
  • 13h30 Doors open
  • 14h00 Welcome: The Center for Electronics Design & Manufacturing (Filip Ponsaerts, imec services cEDM)
  • 14h10 Manufacturability and reliability impact of package selection: The EDM-D-002 Guideline (Geert Willems, imec services cEDM)
  • 14h40 Component package selection in automotive electronics (ON Semiconductor)
  • 15h10 Package and interconnection failure assessment (Bart Vandevelde, imec services cEDM)
  • 15h45 Q & A – discussion 16h00 Networking with drinks and snacks

Send an e-mail to training@imec.be

ON Semiconductor, Westerring 15, 9700 Oudenaarde
Participation fee: 
  • cEDM Member: free
  • cEDM Partner: free
  • Others: € 80