Reliability of Electronics

A selection of topics


Public, Members and Partners

cEDM has been active in a wide variety of subjects, all dealing with the realisation of electronics as a physical entity (Design-for-eXcellence) in which product reliability and robustness takes a leading role.. We have looked into the quality of products exiting production, we study mechanisms that create failures during early life and wear-out, we understand the thermo-mechanical interaction of the environment with the product and the impact on the lifetime of the product, ...
This workshop will give you insight in some of the many aspects of reliability of electronics.
Bart Vandevelde gives an overview of the subjects that are handled in the different research projects as conducted by cEDM. He focusses on “the evaluation of 4-point bending fatigue testing as an alternative for thermal cycling of components”.
Eric Roose has compiled all the knowledge about thermal analysis for electronic systems, and has finalized the cEDM integration guideline “EDM-I-002 : Thermal Integration”. During his presentation, he runs us through the dos and don’ts of thermal design. He explains the need for efficient thermal management. He gives an insight in the different heating and cooling mechanisms that interact in an electronic system and shows different optimization possibilities at PBA level. After the workshop, you will be given access to the thermal guideline EDM-I-002.
Boris Leekens has been involved in electronic failure analysis during the last 5 years @ cEDM. The overview of the failures he has encountered gives an interesting insight in the reliability problems that electronic designers and manufacturers face. During his presentation he categorizes the failures, and gives advice how to avoid the problems.
Finally Pieter Jan Jordaens of OWI-Lab, Sirris elaborates on reliability and robustness importance of power electronics for the wind power industry.
Members and partners can download the presentations of workshop 24 here.
  •  Intro
  •  Presentation1: Results from the cEDM research projects
  •  Presentation2: Thermal Integration Guideline
  •  Presentation3: Avoiding Common Failure Causes - A Practical Overview
  •  Presentation4: Reliability and robustness importance of power electronics for the wind power industry
Friday, May 27, 2016
  • 13:30 Doors open
  • 14:00 Welcome (Geert Willems, imec cEDM)
  • 14:10 First results of the cEDM research projects. (Bart Vandevelde, imec cEDM)
  • 14:40 Thermal Integration guideline explained. (Eric Roose, imec cEDM)
  • 15:10 Coffee break
  • 15:30 Avoiding common failure causes – a practical overview. (Boris Leekens, imec cEDM)
  • 16:00 Reliability and robustness importance of power electronics for the wind power industry. (Pieter Jan Jordaens - Business Development & Innovation - OWI-Lab manager, Sirris)
  • 16:30 Q&A – discussion
  • 16:45 Networking
  • 18:30 Closure

Send an e-mail to academy@imec.be

imec, Kapeldreef 75, 3001 Heverlee
Participation fee: 
  • cEDM Member: free
  • cEDM Partner: free
  • Others: € 150