Workshops

E-Waste recycling optimization and Design-for-Recycling; ENIAC project GreenElec

Date:
Friday, June 7, 2013
Presentations:

Members and partners can download the presentations of workshop 17 here.

PBA Assembly Material Specification - The guideline explained

Date:
Friday, March 22, 2013
Presentations:
Members and partners can download the presentations of workshop 16 here.
  •  Intro
  •  Presentation1: Soldering Materials: Technology, Applications and Reliability aspects
  •  Presentation2: Electrically Conductive Adhesives (ECA's) and Underfill materials
  •  Presentation3: Assembly material related failures and EDM-D-003 Guideline 

PCB build-up and density classification

Date:
Friday, November 23, 2012
Presentations:
Members and partners can download the presentations of workshop 15 here.
  •  Intro
  •  Presentation1: EDM-D-005: PCB Build-Up and Density Classification
  •  Presentation2: Selecting a PCB build-up and density classification for your design - a BGA case
  •  Presentation3: Build-up options versus density classes: How to choose the right PCB Technology
  •  Presentation4: Implementation of the PBA Passport Tool to handle the density classes 

Van Chip Ontwerp tot PBA Productie: Invomec biedt u ondersteuning

Date:
Friday, June 15, 2012
Presentations:

Members and partners can download the presentations of workshop 14 here.

VIS-Traject PROSPERITA

Date:
Wednesday, March 21, 2012
Presentations:

Members and partners can download the presentations of workshop 13 here.

Green IC Packaging

Date:
Friday, November 25, 2011
Presentations:
Members and partners can download the presentations of workshop 12 here.

PBA Onderzoek in Vlaanderen

Date:
Friday, June 17, 2011
Presentations:
Members and partners can download the presentations of workshop 11 here.
  •  Intro
  •  Presentation1: Basic Research on Solder Joint Reliability
  •  Presentation2: Multidisciplinair Ontwerp van Elektronische Modules op PBA Niveau, Brug tussen Theorie en Praktijk
  •  Presentation3: End-of-Life Treatment of Electronics: Environmental and Economic Opportunities
  •  Presentation4: High Performance Integrated Cooling of Electronics
  •  Presentation5: Ingebedde Chips in Printkaarten: van Idee tot Industrialisering
  •  Presentation6: Ultra-Thin Chip Packages (UTCP's) for Embedding in Mainstream Flex Circuits
  •  Presentation7: De 'Subsidieproducten' van het IWT: een Rode Draad 

PBA Kwaliteit en Productietesten

Date:
Wednesday, March 30, 2011
Presentations:
Members and partners can download the presentations of workshop 10 here.
  •  Intro
  •  Presentation1: Predictable product performance @ ASML
  •  Presentation2: How to Design a PBA with build-in Quality and Reliability
  •  Presentation3: Kwantificatie van PBA foutfrekwentie, testdekking en kwaliteitsrisico 

Betrouwbaarheid van Printed Board Assemblages

Date:
Thursday, December 16, 2010
Presentations:
Members and partners can download the presentations of workshop 9 here.

Introductie tot Printed Board Assemblage

Date:
Friday, June 18, 2010
Presentations:
Members and partners can download the presentations of workshop 8 here.

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