Design-for-X Guidelines

Design-for-Robustness (V1.0) 
preview

EDM-D-100

Design and purchasing instructions for PCB laminate Implementation: design rules, purchasing instructions

• Lead-free compatibility of PCB
• Design-for-reliability of PCB (via fatigue)
• PCB Quality/performance requirements
• Solderable finish selection

Purchasing instructions for PCB

• Lead-free compatibility of PCB
• Design-for-reliability of PCB (via fatigue)
• PCB Quality/performance requirements
• Solderable finish selection

Assemby preparation and handling

• Moisture management of PCB: storage and drying
• Packing PCB for storage
• PCB damage prevention in assembly and repair

Purchasing instructions for PCB laminate, customer information.

• Lead-free compatibility of PCB
• Design-for-reliability of PCB (via fatigue)
• Solderable finish

Assemby preparation and handling

• Moisture management of PCB: storage and drying
• Packing PCB for storage

Design and purchasing instructions for components.
Implementation: Approved Components and Manufacturer's List(s)

• Lead-free compatibility of BOM
• Design-for-Reliability of PBA (solder joint, SIR, whisker,... )
• Component Quality/performance requirements
• Terminal finish selection
• Design-for-Assembly: component aspects
• MSL (J-STD-020/J-STD-075) and PSL definition and use for process compatibility

Purchasing instructions for components
Implementation: Approved Components and Manufacturers List(s)

• Lead-free compatibility of BOM
• Assessment of reliability risk of PBA (solder joint, SIR, whisker,... ): liability risks of EMS, customer feedback
• Component Quality/performance requirements
• Terminal finish selection
• Assembly preparation and handling
• Moisture management of components: storage and drying.
• J-STD-020/J-STD-075.
• Reflow profile and wave soldering process set-up
• BOM damage prevention: check for lead-free soldering incompatibility, soldering/cleaning limitations. PSL (J-STD-075)
• inspection instructions

Design (material selection, design-for-cleaning) and assembly instructions
Implementation: Design rules, Assembly instructions

• RoHS, SnPb, lead-free alloy selection
• Design-for-Reliability of PBA (alloy selection,mixed alloys, SIR, thermal mismatch)
• Assembly material quality/performance requirements

Assembly material selection, qualification and handling
Implementation: Qualification, Purchasing, Process and production floor management instructions

• RoHS, SnPb, lead-free alloy selection
• Reliability risk mitigation of PBA (alloy selection,mixed alloys, SIR, thermal mismatch): select safe materials even if they "solder not as well".
• Assembly material quality/performance requirements
• Assembly material storage and handling.

Design rules and assembly plant selection and instructions
Implementation: design rules, PBA passport, NPI release, EMS purchasing instructions

• Automatic machine handling
• Selection of PBA build-up and associated assembly flow
• BOM compatibility with assembly processes
• Component placement
• Repair

Assembly preparation
Implementation: Assembly preparation instructions , methods and tools.

• Identification of assembly flow
• BOM & layout process compatibility check
• Reflow profile and wave soldering process set-up
• Component collection, machine assignment,...
• Assembly cost estimation

Design rules and PCB plant selection and instructions
Implementation: design rules, PBA passport, NPI release, PCB purchasing instructions.

• PCB build-up
• Selecting optimal PCB density
• class: minimization of cost and complexity.
• Cu thickness
• Selecting design matched PCB supplier using density classes.
• Criteria for selecting advanced PCB technologies
• Quality and reliability risks of advanced technologies
• PCB build-up nomenclature

PCB plant selection and instructions
Implementation: PBA passport, PCB purchasing instructions.

• Selecting design matched PCB supplier using density classes.
• Quality and reliability risks of advanced PCB technologies: risk assessment.
• PCB build-up nomenclature
• Input for solder process and repair set-up

PCB manufacturing capabilities, customer support
Implementation: nomenclature, technical capacity identification.

• Communication of technical capabilities
• Quality and reliability risk assessment and related customer communication

Layout rules
Implementation: footprint library, layout rules, design checks

• Footprint design basics for BGA, QFN,...
• Thermal relief

Assembly risk assessment, quality and yield prediction, Design-for-Test.
Implementation: Test strategy development instructions, DfM/DfT evaluation, NPI release

• Quality quantification methodology
• Test coverage quantification
• Test strategy development basics
• DfT guidelines for production test and inspection
• Quality, Test and Non-quality cost prediction

Assembly risk assessment, quality and yield prediction, Test strategy set-up.
Implementation: Test strategy development instructions, manufacturability and testability assessment, cost estimation method

• Quality quantification methodology
• Test coverage quantification
• Test strategy development basics
• Quality, Test and Non-quality cost prediction
• Customer communication and quotation

• Identification of technology, manufacturing and test capability needs for PCB and PBA: PBA Passport.
• Design-for-X evaluation.
• Cost, quality, reliability and supply risk assessment.
• PCB supplier selection and qualification.
• PBA assembly selection and evaluation.

• Assembly capability mapping.
• PBA design assembly analysis and quotation.
• Assembly preparation.
• Customer communication.

• PCB manufacturing capability mapping.
• PCB manufacturing analysis and quotation.
• Manufacturing preparation.
• Customer communication.

• Understanding impact of vibration and PBA fixation on PBA reliability.
• Vibration load assessment
• Guidelines for pre-layout fixation point and stiffner location