Through Hole Solder Fill

The 'Through Hole Solder Fill Calculator' calculates the maximum possible solder fill percentage relative to the board thickness of plated through holes during wave or selective soldering of through hole components. Input parameters are the soldering conditions, component dimensions (thermal capacity) and PCB build-up and via connectivity (e.g. PCB thickness, number of layers, connection to the copper layers, use of thermal reliefs, ...).

Members and partners can download a member demo version of the calculator for free from the website.

A full version is also for sale. For more information please contact us.

More information on membership / partnership

Through-Hole-Solder-Fill

[[nid:95]]