New standard releases
IPC-1402, Standard for Greener Cleaners Used in Electronic Manufacturing - Released December 2022
IPC-2292A, Design Standard for Printed Electronics on Flexible Substrates - Released December 2022
IPC-7092A, Design and Assembly Process Implementation for Embedded Circuitry - Released December 2022
IPC-2228, Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards - Released October 2022
IPC-4592, Requirements for Printed Electronics Functional Dielectric Materials - Released October 2022
IPC-5262, Design, Critical Process and Acceptance Requirements for Polymeric Applications - Released October 2022
IPC-7801A, Reflow Oven Process Control Standard - Released October 2022
IPC/WHMA-A-620E, Requirements and Acceptance for Cable and Wire Harness Assemblies - Released October 2022
IPC J-STD-004C, Requirements for Soldering Fluxes - Released March 2022
IPC-4202C, SPECIFICATION FOR FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS - Released March 2022
IPC-4412C, SPECIFICATION FOR FINISHED FABRIC WOVEN FROM "E" GLASS FOR PRINTED BOARDS - Released March 2022
IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards - Released March 2022
IPC-7525C, Stencil Design Guidelines - Released March 2022
IPC-D-620A, Design and Critical Process Requirements for Cable and Wiring Harnesses - Released March 2022
IPC-2591 v1.4, Connected Factory Exchange - Released January 2022
IPC-1401A, Corporate Social Responsibility Management System Standard - Released November 2021
IPC-9709A, Guidelines for Acoustic Emission Measurement Method During Mechanical Testing - Released November 2021
IPC-T-50N, Terms and Definitions for Interconnecting and Packaging Electronic Circuits - released November 2021
IPC-1791B, Trusted Electronic Designer, Fabricator and Assembler Requirements - Released October 2021
IPC-6013E, Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards - Released October 2021
IPC-6017A, Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry - Released October 2021
IPC-4552B, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards - Released August 2021