New standard releases:IPC-A-610J & J-STD-001J

IPC J-STD-005B, Requirements for Solder Pastes - Released April 2024

IPC J-STD-004D, Requirements for Soldering Fluxes - Released April 2024

IPC J-STD-001J, Requirements for Soldered Electrical and Electronic Assemblies - Released April 2024

IPC-A-610J, Acceptability for Electronic Assemblies - Released April 2024

IPC-4922, Requirements for Sintering Materials for Electrical and Thermal Interconnects - Released April 2024

IPC-4562B, Specification for Metal Base Copper Clad Laminates for Printed Boards - Released April 2024

IPC-4413, Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards - Released April 2024

IPC-7711/21D, Rework, Modification and Repair of Electronic Assemblies - Released January 2024

IPC-2221C, Generic Standard on Printed Board Design - Released January 2024

IPC-1791D, Trusted Electronic Designer, Fabricator and Assembler Requirements - Released January 2024

IPC-1782B, Standard for Manufacturing and Supply Chain Traceability of Electronic Products - Released January 2024

IPC-2591 V1.7, Connected Factory Exchange - Released October 2023

IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards - Released October 2023

IPC-7352, Generic Guideline for Land Pattern Design - Released July 2023

IPC-997A, Press-fit Standard for Automotive Requirements and other High-Reliability Applications - Released July 2023

IPC-2591 V1.6, Connected Factory Exchange (CFX) - Released March 2023

IPC-1791C, Trusted Electronic Designer Fabricator and Assembler Requirements - Released March 2023

IPC-1792, Standard for the Management and Mitigation of Cybersecurity Incidents in the Manufacturing Industry Supply Chain - Released February 2023

IPC-7091A, Design and Assembly Process Implementation of 3D Components - Released February 2023

IPC-8971, Requirements for Electrical Testing of Printed Electronics E-Textiles - Released February 2023

IPC-8952, Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles - Released February 2023

IPC-9203A, Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly - Released February 2023

IPC J-STD-003D, Solderability Tests for Printed Boards - Released February 2023

IPC J-STD-004C WAM1, Requirements for Soldering Fluxes - Released February 2023

IPC/JEDEC J-STD-020F, Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs) - Released February 2023

IPC/JEDEC J-STD-035A, Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices - Released February 2023

IPC-1402, Standard for Greener Cleaners Used in Electronic Manufacturing - Released December 2022

IPC-2292A, Design Standard for Printed Electronics on Flexible Substrates - Released December 2022

IPC-7092A, Design and Assembly Process Implementation for Embedded Circuitry - Released December 2022

IPC-2228, Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards - Released October 2022

IPC-4592, Requirements for Printed Electronics Functional Dielectric Materials - Released October 2022

IPC-5262, Design, Critical Process and Acceptance Requirements for Polymeric Applications - Released October 2022

IPC-7801A, Reflow Oven Process Control Standard - Released October 2022

IPC/WHMA-A-620E, Requirements and Acceptance for Cable and Wire Harness Assemblies - Released October 2022

IPC J-STD-004C, Requirements for Soldering Fluxes - Released March 2022

IPC-4202C, SPECIFICATION FOR FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS - Released March 2022

IPC-4412C, SPECIFICATION FOR FINISHED FABRIC WOVEN FROM "E" GLASS FOR PRINTED BOARDS - Released March 2022

IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards - Released March 2022

IPC-7525C,  Stencil Design Guidelines - Released March 2022

IPC-D-620A, Design and Critical Process Requirements for Cable and Wiring Harnesses - Released March 2022