Monday, January 25, 2021

Workshop language is English.

This webinar is part of the COOCK project 'Orienting and deciding in smart product exploration'. More information about this project can be found on the project page

Wednesday, September 30, 2020

Lecturer: Geert Willems, Ph.D., imec
Presentation: video streaming
Interaction: MS Teams parallel session
imec employees can participate on-site (max. 20)

Friday, December 8, 2017

Electronics Everywhere, Everything Connected, Internet of Things (IoT), City of Things, Industry 4.0 all imply a distributed network of a large number of electronic devices that must be able to handle confidential, safety critical or other secured data in a reliable way. With 50 billion active devices by 2020 it is likely that security incidents will increase as well as the failure probability of the network. A high level of network availability throughout the envisaged operational lifetime is essential. Security and reliability of electronics is key for IoT. The relationship between both will be explored in this event.

We selected four speakers for you to highlight different security and reliability aspects.
Ulrich Seldeslachts, LSEC, will explain you how to implement security-thinking into electronics design as well as the importance of the supply of qualified components and reliable electronics.
The payment industry is characterized by a high level of security. With the rise of “always connected” devices, the need for the same type of protection is emerging in a lot of other industries. Peter Timmermans, ATOS Worldline, will present the attacks against which we have to protect a payment terminal, how this can be realized and what are the consequences of this type of precautions.
Obviously, electronic device failures are unwanted. Surprisingly, the unique features of certain IC transistor failure mechanisms can be exploited to create low cost, high security solutions. Thomas Kallstenius, imec, introduces you into the world of security embedding in Integrated Circuits.
Electronics reliability is the main theme in today’s cEDM activities. Geert Willems, imec, will explain why Physics-of-Failure based Design-for-Reliability is essential for the development of reliably operating secured electronics networks.

 cEDM Event 2017

  •  Presentation: Security Design Thinking for Industrializing IoT and Industry 4.0
  •  Presentation: Hardware Security in the payment industry
  •  Presentation: Failure mechanisms turned into an asset: new ways of embedding key security elements in IC’s
  •  Presentation: Towards Physics-of-Failure based “Reliable-by-Design” electronics
  •  Recording
Friday, November 25, 2016

Press release 22/9/2016
Renewed imec confirms its role as the world’s leading research center for nanoelectronics and digital technology

Ghent and Leuven – 22 September 2016. Since yesterday, the merger between research centers imec and iMinds – announced on February 19 – has been completed. The deed of merger was officially signed in Brussels, in the presence of Flemish minister-president Geert Bourgeois and Flemish minister for work, the economy, innovation and sport Philippe Muyters. iMinds vzw thereby ceased to exist, but its activities are making a new start within imec, which is now stronger than ever as a unique high-tech research center for the digital economy.

No doubt you have heard about the merger of imec with the iMinds research organization. The extended imec combines the world class electronics hardware technology of imec with the state-of-the-art software expertise of iMinds and its well-established innovation services supporting regional industry.

1+1>3 on the innovation front, that is what the extended imec is aiming for. The combination of advanced hardware, the newest software techniques, data science, living labs to assess user experience and effective, low threshold innovation services creates a large potential to boost the innovative strength and the international competiveness of our industry, especially the manufacturing industry.

In this event we will provide a concise overview of the software and data science competences of imec. Responsibles from imec’s Innovation Services will present innovation tools as imec.icon, imec.livinglabs and software prototyping with practical realizations and examples in the domain of smart cities, smart energy, health care, mobility, logistics and industry 4.0.
Before diving into the new opportunities an overview of the cEDM activities will be presented.

After the presentations there is ample time for a visit to the booths and for networking. Snacks and drinks will be within reach.

 Press release

 cEDM Event 2016

Friday, November 20, 2015

In the Western electronics industry the dominating paradigm of the 1990’s was a dismantling of the vertically integrated electronics companies and a massive subcontracting of manufacturing to low labor cost factories in the (Far) East. This has led to a highly complex and fragmented electronics supply chain.

Recently many companies have become aware of the disadvantages of manufacturing at the other side of the planet when servicing their Western customers. Re-shoring and near-shoring are the new buzz words. Combined with a renewed interest and stimulation of local manufacturing by US and EU governments a paradigm shift in electronics manufacturing may be on the verge of a breakthrough.

During this cEDM event we will give a view on this paradigm shift and what is key to competitive electronic products nearby.

Geert Willems of cEDM explains how the main asset of the Benelux – brainpower – can be a major competitive advantage in electronics product development and manufacturing. An overview of cEDM’s knowledge supporting electronic product development will be presented.

Two of our partners will testify on how they successfully manage their manufacturing:

  • Gert D’Handschotter explains why he has taken the decision to integrate electronics manufacturing in his company E.D.&.A and what is key to its success.
  • Guy de Winne will enlighten us on Newtec Manufacturing Competence Centre’s view on competitive manufacturing of Newtec products and to provide manufacturing services to 3rd parties. He will explain what is behind Newtec’s “2015 Factory of the Future” award.

Finally, Craig Hillman will explain the importance of product reliability and Design-for-Reliability. DfR Solutions (US) has developed the tool Sherlock to assist the Design for Reliability process.

During the afternoon, you have the possibility to visit an exhibition where cEDM and its partners showcase their developments, tools and services.

 cEDM Event 2015

  •  Presentation: Competitive electronics assembly nearby (Geert Willems, imec - cEDM)
  •  Presentation: Taking manufacturing activities back in your own hands (Gert D'Hanschotter, E.D.&A.)
  •  Presentation: Shaping the future of satellite communications (Guy de Winne, Newtec)
  •  Presentation: Design for Reliability: A Condition for Successful Product Introduction (Craig Hillman, DfR Solutions)
  •  Recording
Thursday, October 9, 2014

Imec’s Center for Electronics Design & Manufacturing (cEDM) activities are aimed at supporting the industry in the development of cost effective quality electronics. cEDM cooperates internationally on research, knowledge creation and sharing with organizations like iNEMI (the International Electronics Manufacturing Initiative –, SPM (a Danish electronics’ industry association – and others in, e.g., the framework of international projects.
This event gives you the opportunity to get to know cEDM’s international network that brings state-of-the-art knowledge to our electronics’ industry.

The yearly overview of cEDM activities will be presented by cEDM manager Geert Willems.

Grace O’Malley,Vice President of Operations for iNEMI, will present a selection of iNEMI projects and the value proposition of iNEMI.

SPM, an association from Denmark and cEDM partner, will present its activities with focus on electronics reliability.

Environmental aspects have become of considerable importance. Ruud Balkenende from Philips Nat Lab in The Netherlands and project leader of the ENIAC project GreenElec will talk on Design-for-Recycling and bridging the Design-Recycling gap.

After the presentations there is ample time for a visit to the booths and for networking. Snacks and drinks will be within hand reach.

 cEDM Event 2014

  •  Presentation: cEDM activity overview (Geert Willems, imec - cEDM)
  •  Presentation: iNEMI activities - projects and iNEMI value proposition (Grace O'Malley, iNEMI)
  •  Presentation: SPM – Electronics design, production and testing in Scandinavia: SPM activities (Hans Fhær Larsen, SPM)
  •  Presentation: ENIAC GreenElec project on Electronics design and recycling (Ruud Balkenende (Project leader), Philips - Nat Lab)
Friday, October 4, 2013

Imec’s Center of Electronics Design & Manufacturing activities are aimed at supporting the industry in the development of cost effective quality electronics. When improved, multidisciplinary insight in the physical realisation of electronics throughout the electronic supply chain is brought to the operational departments and factory floor by means of guidelines, tools, consultancy and training this has a significant positive effect on the business results. This event will give you an understanding of how and to what extent cEDM’s expertise may help your company.
An overview of cEDM activities will be presented. A view on what some of our cEDM partners have done with cEDM know-how and how they have thrived the last five years will be given.
Lena Eeckhout, Manager PCB Layout Services of Barco, will present Barco’s newly, worldwide deployed PCB/PBA New Product Introduction process. This NPI business process was developed and deployed in collaboration with imec’scEDM and integrates several of cEDM’s innovations (PCB specification, PCB failure calculation, PBA passport, Design-to-supplier matching, etc).
Eric Roskin now at Pepric has been working with cEDM for many years in the field of PCB/PBA design and manufacturing. He will share with you his cEDM collaboration experience as an industrialisation engineer.
After the presentations there is ample time for avisit to the booths and for networking.Thisgives you theopportunityto further explorethevarious aspects of thecEDMand imecservicesoffering as well as thecEDM partner network.Snacks and drinks will be within hand reach.

 cEDM Event 2013

  •  Presentation: imecservices (Steve Beckers, imec services)
  •  Presentation: cEDM activities from a business perspective (Geert Willems, imec cEDM)
  •  Presentation: Barco's PCB/PBA New Product Introduction methodology (Lena Eeckhout, Barco)
  •  Presentation: Working with cEDM in Industrialization (Eric Roskin, Pepric)
Friday, October 5, 2012

Wat heeft cEDM de industrie te bieden? Hoe kunnen wetenschappelijk onderbouwde methoden vertaald worden naar nuttig toepasbare hulpmiddelen in de industrie? Hoe deze methoden inzetten doorheen de toeleveringsketen? cEDM partners getuigen.

Onze cEDM Partner ASML presenteert het MoVIP-project (Modellering van de Voorspelbaarheid van Initiële productkwaliteit.)

Het project bouwt voort op het Defect Opportunity (DO) en Defect-Per-Million-Opportunity (DPMO) concept, ontwikkeld op basis van IPC-7912 door cEDM, voor het kwantificeren van PBA kwaliteit, yield en testdekking. Zestien MoVIP projectpartners uit verschillende technologische disciplines werken het DO concept verder uit voor volledige industriële systemen (mechatronisch/optisch), rekening houdend met de afwijkende karakteristieken van deze systemen t.o.v. PBA’s.
MoVIP illustreert hoe een wetenschappelijk onderbouwde methode, ontwikkeld in het kader van het cEDM programma, antwoord geeft op een concrete bedrijfsproblematiek.

Na het presentatiegedeelte volgt een standenbezoek en mogelijkheid tot netwerking. Hierbij heeft u ruim de gelegenheid om diepgaander kennis te maken met verschillende aspecten van het cEDM programma en het cEDM netwerk. Standen van o.a. cEDM partnerbedrijven verschaffen u gelegenheid tot kennismaking, netwerking en informatie-uitwisseling. Dit alles begeleidt met een hapje en een drankje.

 cEDM Event 2012 (NL)
 cEDM Event 2012 (EN)

  •  Presentation: cEDM Activities (Geert Willems, imec)
  •  Presentation: MoVIP (Dick van Hees, ASML)
  •  Presentation: Influence of Pick & Place Machines on Product Quality (Sjef van Gastel, Assembléon)
Friday, September 30, 2011

Wat heeft het EDM programma de industrie te bieden? Hoe helpt het EDM-programma de uitdagingen aan te gaan? EDM partners getuigen.
EDM Partner ASML illustreert hoe wetenschappelijke onderbouwde methoden, ontwikkeld in het kader van het EDM programma, antwoorden geven op deze concrete bedrijfsproblematiek. EDM partner OnSemi bespreekt de uitdagingen die moderne PBA’s en hun toepassingen betekenen voor een IC fabrikant.

De visie van het EDM programma, de belangrijkste resultaten en het nieuwe EDM initiatief VIS-traject Prosperita worden kort toegelicht. Prosperita beoogt de uitwerking en verspreiding van een generieke PBA (Printed Board Assembly) Design-for-Manufacturing en een PBA integratie handleiding, een traject waarin ook u kan participeren.

Na het presentatiegedeelte volgt een standenbezoek en mogelijkheid tot netwerking. Hierbij heeft u ruim de gelegenheid om diepgaander kennis te maken met verschillende aspecten van het EDM programma en het EDM netwerk. Rechtstreekse ervaringsuitwisseling rond de meerwaarde van EDM is mogelijk met EDM partner getuigen op de EDM programma stand. Standen van EDM partnerbedrijven, vakorganisaties, kenniscentra en Vlaamse industrie @ imec verschaffen u gelegenheid tot kennismaking, netwerking en informatie-uitwisseling.

 cEDM Event 2011

  •  Presentation: Intro (Filip Ponsaerts, imec)
  •  Presentation: Predictable Initial Product Performance (Ruud van Beek, ASML)
  •  Presentation: PBA kwaliteit: cijfers graag! (Geert Willems, imec)
  •  Presentation: Active Components in today's PBA: Challenges for ON Semi (Eddy Blansaer, ON Semi)
  •  Presentation: Electronic Design & Manufacturing Programma (Geert Willems, imec)
  •  Presentation: Standenoverzicht (Filip Ponsaerts, imec)
  •  Presentation: Novel PCB Technology Allowing Alternative Carrier Materials (Jan Vanfleteren, imec - UGent/CMST)