Wednesday, October 11, 2023
  • Intro: Introduction
  • Presentation 1: Introduction to Life Cycle Assessment, LCI and LCIA
  • Presentation 2: Internet-of-Things for the best and the worst
  • Presentation 3: Lean eco-design of electronics based on parametric LCI analysis
  • Presentation 4: Parametric LCI analysis of PCB manufacturing and assembly
  • Presentation 5: Assessing the environmental impact of integrated circuit chip manufacturing
Friday, November 4, 2022
  • Presentation 1: System Engineering based Smart Product Exploration.
  • Presentation 2: Smart Product development readiness of the system engineering organization.

Electronics Cooling and Interconnect Technologies

for Vehicle Computers

Tuesday, May 18, 2021
  • Introduction: HIPER: Introduction to collaborative research project on High Performance Vehicle Processors
  • Presentation 1: Advanced 3D printing solutions for advanced processor cooling
  • Presentation 2 Part A: 3D printing technology
  • Presentation 2 Part B: Simulation and characterisation of cooling performance of 3D printed heat sink
  • Presentation 3: Low melting point solder technology for advanced processor components

Towards an Improved Lifetime Prediction of Electronics

Friday, January 10, 2020
  • Introduction
  • Presentation 1: Reliability by design approach for life time prediction of electronic systems
  • Presentation 2: Challenging the acceleration factor models by a Long-Term life Testing on a soldered board assembly
  • Presentation 3: Engineering model for the life prediction of LED drivers
  • Presentation 4: Design-for-Robustness for electronics
  • Video of workshop


Space Electronics for the 21st Century


Thursday, June 13, 2019
  • Presentation 1: Introduction to Space Electronics for the 21st Century
  • Presentation 2: Improving Space Electronics: a review of opportunities
  • Presentation 3: Electronics for earth orbit satellite missions: Proba-V
  • Presentation 4: Life Cycle Assessment and eco-design of the PROBA-V space mission: focus on space electronics
  • Presentation 5: High-density Printed Circuit Boards for Space Electronics
  • The ESA and Verhaert presentations were cancelled because of last-minute unavailability of the speakers.

Smart New Product Introduction

Wednesday, November 7, 2018
  •  Presentation1: Predictive New Product Introduction for Smart Products
  •  Presentation2: New Product Introduction Process in a Startup Company
  •  Presentation3: Think before you act, leads to “right first time”
  •  Presentation4: World Wide NPI: the PBA Passport opens the manufacturing doors
  •  Presentation5: The Smart Product Initiative

Flexible Electronics

Wednesday, May 23, 2018
  •  Presentation1: Advantages and challenges of flex-rigid PCB technology
  •  Presentation2: Challenges in design and assembly using flex substrates
  •  Presentation3: Challenges and opportunities in printed electronics manufacturing
  •  Presentation4: Stretchable circuits

Reliable Electronics for Aerospace

Thursday, January 18, 2018
  •  Presentation1: Challenges of segmented supply chains in component qualification for space
  •  Presentation2: Automatization for large solar panels assembly
  •  Presentation3: Reliable electronics for aerospace
  •  Presentation4: Aluminum silicon carbide
  •  Presentation5: Contribution of multiphysics simulation to reliable microsystem packaging

How autonomous and electric cars push the need for more reliable electronics

Friday, September 22, 2017

Members and partners can download the presentations of workshop 27 here.

  •  Intro
  •  Presentation1: Next Generation Approaches for Reliability of Automotive Smart Systems
  •  Presentation2: Automotive electronic components qualification standards and guidelines: update of the current status
  •  Presentation3: Challenges for future connected and automated cars
  •  Presentation4: Improving the reliability of electronic systems using potting
  •  Presentation5: cEDM’s DfR for automotive electronics: experiences and strategy